High speed, high density backplane connector
US6641438B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 7, 2002 |
| Grant date | Nov 4, 2003 |
| Priority date | — |
| Expiry date | Jun 7, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/727
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A backplane connector (100) includes a connector housing (1) defining plural openings (14) therethrough, a number of signal terminals (11) arranged in the connector housing, a number of circuit boards (2) retained in respective openings, and a shield member (3). Each circuit board is provided with signal traces (20) and conductive layer (21) on opposite sides thereof. The shield member substantially encloses the connector housing and the circuit boards. The shield member has a number of inwardly projected, resilient tabs (301) stamped therefrom. The resilient tabs are arranged in two staggered rows and each extend between adjacent circuit boards for mechanically and electrically contacting with the conductive layer of a corresponding circuit board to thereby achieve a grounding purpose.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.