Finishing components and elements
US6641463B1 · kind B1 · utility
37Cited by
64References
40Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 20, 2002 |
| Grant date | Nov 4, 2003 |
| Priority date | — |
| Expiry date | May 20, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S451/921
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
New, versatile finishing surfaces are described. Unitary finishing elements having discrete finishing members attached to unitary resilient body are disclosed for finishing microdevices such as semiconductor wafers. Finishing surfaces such as discrete finishing members can be comprised of a multiphase polymeric composition. The new unitary finishing elements have lower cost to manufacture and high precision. The unitary finishing elements and finishing surfaces can reduce unwanted surface defect creation on the semiconductor wafers during finishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.