Sputtering device
US6641702B2 · kind B2 · utility
12Cited by
8References
43Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2001 |
| Grant date | Nov 4, 2003 |
| Priority date | — |
| Expiry date | Sep 26, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/568
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention is directed to a sputtering device for depositing multi-layer films on a substrate, the sputtering device comprising at least one planar-magnetron-sputtering-cathode and at least one facing-targets-sputtering-cathode housed in a single vacuum chamber, and adapted such that each planar-magnetron-sputtering-cathode and facing-targets-sputtering-cathode can be selectively positioned for sputtering deposition onto a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.