Process of fabricating flip chip interconnection structure
US6642079B1 · kind B1 · utility
27Cited by
8References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2002 |
| Grant date | Nov 4, 2003 |
| Priority date | — |
| Expiry date | Oct 1, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a process of fabricating flip chip interconnection, a UBM layer is deposited on an I/O pad of a chip. The UBM layer includes a nickel layer. On the UBM layer is formed a tin-containing solder material. The chip is mounted on a carrier substrate by alignment of the bonding pad with a contact pad of the carrier substrate. A reflow process is performed to respectively turn the tin-containing solder material to a tin-containing solder bump and form a composite intermetallic compound on the nickel layer of the UBM to prevent its spalling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.