Polyolefin-based composite resin composition having high strength and low linear expansion
US6642312B2 · kind B2 · utility
6Cited by
2References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2001 |
| Grant date | Nov 4, 2003 |
| Priority date | — |
| Expiry date | Dec 26, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a polyolefin-based composite resin composition having excellent dimensional stability due to low mold shrinkage, low linear thermal expansion coefficient and low heat sag as well as having excellent mechanical strength, impact resistance, heat resistance, injection molding plasticity and surface smoothness of a product. The composition includes: 30-80% by weight of a crystalline ethylene-propylene copolymer; 5-40% by weight of an ethylene-&agr;-olefin copolymer; 5-40% by weight of an inorganic fortifier; and additives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.