Method and apparatus for replicating heat profile of infrared oven
US6642486B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2002 |
| Grant date | Nov 4, 2003 |
| Priority date | — |
| Expiry date | Nov 7, 2022 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27D21/0014
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A system and method for developing a heat treatment process using a model radiative-heating oven, which repeatably and accurately simulates an industrial heat treatment system. In order to simulate the industrial heat treatment system, the model radiative-heating oven uses a variety of scaling factors, such as heating density parameters. The model radiative-heating oven also may have a quickly openable and closable object carrier, which facilitates a timely start and end of a desired heat treatment process. An oven temperature stabilizer also may be provided for thermally stabilizing the model radiative-heating oven prior to the desired heat treatment process. The present technique also may utilize a variety of heat profile controls, such as time, temperature, and power levels, to provide the desired heat profile in the heat treatment process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.