Probe structure and manufacturing method thereof
US6642731B2 · kind B2 · utility
4Cited by
10References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 17, 2002 |
| Grant date | Nov 4, 2003 |
| Priority date | — |
| Expiry date | Dec 17, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R3/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In a probe structure which has a bump contact protruded from one surface of an insulating substrate, the bump contact is deposited such that a surface roughness falls within a predetermined range specified by Rmax within a range from 0.01 to 0.8 &mgr;m, Ra within a range from 0.001 to 0.4 &mgr;m, and a ratio of Rmax/Ra within a range from 2 to 10. Such a surface roughness is realized by depositing a convex/concave layer formed by aggregation of fine grains. The convex/concave layer is directly deposited to a basic shape portion without any intermediate layer left between the convex/concave layer and the basic shape portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.