Patent · US Expired

Advanced electronic microminiature coil and method of manufacturing

US6642827B1 · kind B1 · utility

64Cited by
19References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 13, 2000
Grant dateNov 4, 2003
Priority date
Expiry dateApr 11, 2021

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/4902
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

An advanced microelectronic coil device incorporating a toroidal core and a plurality of sets of windings, wherein the windings are separated by one or more layers of insulating material. In one embodiment, the insulating material is vacuum-deposited over the top of a first set of windings before the next set of windings is wound onto the core. In this fashion, the insulating material insulates the entire first winding from the second without the need for individual insulation on each of the windings, or the use of margin tape. The use of the vacuum-deposited insulating layer(s) provides a high degree of dielectric strength, yet consumes a minimum space since the insulation on each winding is minimized. The toroidal core is also optionally provided with a controlled thickness gap for controlling saturation of the core.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.