Low-loss electrode structures using resistive connections for optical modulation applications
US6643048B2 · kind B2 · utility
1Cited by
7References
35Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 21, 2001 |
| Grant date | Nov 4, 2003 |
| Priority date | — |
| Expiry date | Jun 21, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/0356
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical device includes a grounded base and an optical modulator chip having a top surface, a back surface and side surfaces. The optical modulator chip is positioned on the grounded base with the back surface facing the grounded base. The optical modulator chip includes a first ground electrode, a signal electrode and a second ground electrode located over the top surface of the optical modulator chip. The first and second ground electrodes of the optical modulator chip are interconnected with resistive layers on a surface of the optical modulator chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.