Parametric programming of laser cutting system
US6643561B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 30, 1999 |
| Grant date | Nov 4, 2003 |
| Priority date | — |
| Expiry date | Dec 30, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
The present invention is part of a system and method for creating products of varying characteristics on an automated production line. The system includes one or more production line devices, for example robots and machines. Specifically, the present invention provides a system and method for automating a laser cutting device. The method comprises receiving a data file to the laser cutting device, converting the data file to an instruction file, and operating the laser cutting device with the instruction file. The instruction file may be a computer numeric control computer program, for example. The data file includes characteristics to be created on a workpiece by the laser cutting device. In one embodiment, the method may further comprise programming the laser cutting device with a parametric computer program, such that the parametric computer program receives the data file. In another embodiment, the method may further comprise automatically connecting a power source to the laser cutting device, when the laser cutting device receives the data file.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.