System and method for collecting and analyzing shipment parameter data affecting predicted statistical variables of shipped articles
US6643608B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2000 |
| Grant date | Nov 4, 2003 |
| Priority date | — |
| Expiry date | Feb 22, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F17/18
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system for collecting and analyzing shipment parameter data, e.g., temperature, vibration, acceleration, shock, humidity, barometric pressure, pH, transit time, container position, etc., affecting predicted statistical variables of articles is provided. Examples of the predicted statistical variables may include article life expectancy, warranty costs, service and/or maintenance schedules, etc. The system is made up of a plurality of data collection subsystems for respectively collecting shipment parameter data encountered by respective articles being shipped, and a data analysis subsystem coupled to receive the collected shipment data for adjusting the respective predicted statistical variables of the articles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.