Polishing composition and polishing method for polishing a substrate to be used for a memory hard disk employing it
US6645051B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2001 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Feb 15, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/8404
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing composition for a substrate to be used for a memory hard disk, which comprises the following components (a) to (d):(a) water,(b) at least one compound selected from the group consisting of a polyoxyethylene polyoxypropylene alkyl ether and a polyoxyethylene polyoxypropylene copolymer,(c) at least one compound selected from the group consisting of nitric acid, nitrous acid, sulfuric acid, hydrochloric acid, molybdic acid, sulfamic acid, glycine, glyceric acid, mandelic acid, malonic acid, ascorbic acid, glutamic acid, glyoxylic acid, malic acid, glycolic acid, lactic acid, gluconic acid, succinic acid, tartaric acid, maleic acid and citric acid, and their salts, and(d) at least one abrasive selected from the group consisting of aluminum oxide, silicon dioxide, cerium oxide, zirconium oxide, titanium oxide, silicon nitride and silicon carbide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.