Electroplating bath control
US6645364B2 · kind B2 · utility
21Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2001 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Dec 13, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T436/24
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a method of analyzing components in an electroplating bath. Also disclosed is a method of controlling electroplating baths by monitoring the components of the plating bath in real-time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.