Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions
US6645557B2 · kind B2 · utility
27Cited by
44References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 17, 2001 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Oct 17, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/181
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming a conductive metal layer on a non-conductive surface, including providing a non-conductive surface; contacting the non-conductive surface with an aqueous solution or mixture containing a stannous salt to form a sensitized surface; contacting the sensitized surface with an aqueous solution or mixture containing a silver salt having a pH in the range from about 5 to about 10 to form a catalyzed surface; and electroless plating the catalyzed surface by applying an electroless plating solution to the catalyzed surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.