Process for producing printed wiring board
US6645685B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2001 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Oct 24, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03G13/286
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed is disclosed a process for producing a printed wiring board which comprises the steps of:a) exposing a wiring board having at least one photoconductive layer in which its chargeability is changed by light exposure on at least one surface of a conductive support which comprises an insulating substrate and at least one metal conductive layer provided at least one surface thereof through a resist pattern;b) charging the photoconductive layer to form an electrostatic latent image;c) forming a toner image on the photoconductive layer by toner developing treatment;d) removing a portion of the photoconductive layer to which no toner is attached by dissolution to form a resist image; ande) removing a portion of the metal conductive layer other than a portion where the resist image is formed by etching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.