Patent · US Expired

Method of producing an optoelectronic component

US6645783B1 · kind B1 · utility

22Cited by

2References

14Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Herbert Brunner · Sinzing, DE
Hans Hurt · Regensburg, DE

Key dates

Filing date	Apr 24, 2000
Grant date	Nov 11, 2003
Priority date	—
Expiry date	Apr 24, 2020

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1815
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The optoelectronic component has a radiation-receiving or radiation-emitting semiconductor chip mounted on a base part. The chip is contacted with at least two electrode terminals made of an electrically conductive connection material. The electrode terminals are formed by a thin coating, which is deposited on the outer surfaces of the base part, is applied by electrodeposition and is patterned by means of laser etching.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.