Key hole filling
US6645857B1 · kind B1 · utility
10Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2002 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Jul 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76877
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming an electrically conductive via that abuts a key hole formed in filler material. A void is etched through the filler material in which the key hole is formed, thereby forming a link between the void and the key hole. A liner is formed within the void, where the liner is formed to a thickness that is at least about half a minimum cross sectional dimension of the key hole, so as to plug the link between the void and the key hole and thereby trap any contaminants within the key hole. Electrically conductive via material is deposited within the void to form the via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.