Resin composition containing crystalline polyimide
US6646060B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2001 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Jan 10, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition containing a mixture produced by blending a crystalline polyamide expressed e.g. by formula (1) (in the formula, R1 is a bivalent organic aromatic group or aliphatic group having a carbon number of 2 to 30, optionally having substituent and optionally containing non-reactive groups such as ether group and aromatic group in the main chain, and Ar1 is an aromatic residue having a carbon number of 6 to 45 and optionally having substituent) with a thermoplastic polyester. The resin composition has excellent mechanical characteristics such as high elastic modulus, flow properties and heat-resistance and is suitable as a material for an electronic part for surface mounting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.