Low emission formaldehyde resin and binder for mineral fiber insulation
US6646094B1 · kind B1 · utility
13Cited by
9References
62Claims
0Family size
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Key dates
| Filing date | Dec 17, 2001 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Apr 17, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/21
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A phenol-formaldehyde resole resin is prepared using a high level of catalyst at a polymerization temperature of about 63° C. The endpoint, measured by salt water tolerance, is selected so that the resulting resin has a water dilutability of 20:1 at neutral pH after storage for three weeks at a temperature of about 13° C., with a free phenol level of no more than 0.50 percent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.