Semiconductor chip and multi-chip module
US6646342B2 · kind B2 · utility
2Cited by
10References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2002 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Mar 14, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bare-chip IP of a multi-chip module and an external device of the multi-chip module are interfaced with each other through a dedicated I/O bare-chip IP. Each of the bare-chip IPs other than the dedicated I/O bare-chip IP is not provided with an interface circuit for connection to the external device, and thus is only required to have a withstand voltage characteristic corresponding to the operating voltage of an internal circuit. As a result, it is only necessary to provide, on the bare-chip IPs, transistors of a few kinds of withstand voltage characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.