Balun and semiconductor device including the balun
US6646518B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 16, 2001 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Dec 13, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/10
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A balun includes a first conductive layer disposed on a top surface of a substrate, a second conductive layer having a shorter length than the first conductive layer and disposed on the top surface of the substrate, the second conductive layer having first and second end portions, a substrate having a through hole electrically connected to the second end portion of the second conductive layer, and a third conductive layer disposed on a bottom surface of the substrate, the third conductive layer having a first end portion electrically connected to the second end portion of the second conductive layer via the through hole, and the third conductive layer being tapered from a maximum width at the second end portion thereof to a minimum width at the first end portion thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.