Connection for conducting high frequency signal between a circuit and a discrete electric component
US6646521B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 15, 2000 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Sep 15, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/328
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for processing high frequency signals comprises a circuit board has a trace. An electrical circuit is fabricated on a die, which is mounted on the circuit board. The die has a top portion and a contact point is positioned on the top portion. The circuit is configured to process a signal having a frequency in the range of about 20 GHz and higher. A capacitor is mounted on the circuit board and has a top portion and bottom portion. The bottom portion opposes the trace. A wire extends between the contact point on the top portion of the die and the top portion of the capacitor. The wire has a length in the range of about 2 mils to about 12 mils.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.