Loss prevention structures for optical modulation applications
US6646781B2 · kind B2 · utility
0Cited by
8References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 13, 2001 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Feb 13, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/0356
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical device includes a grounded base and an optical modulator chip having a top surface, a back surface and side surfaces. The optical modulator chip includes a first ground electrode, a signal electrode and a second ground electrode located over the top surface of the optical modulator chip. A resistive paint is on the back surface of the optical modulator chip to reduce losses due to extraneous modes or bias instabilities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.