Fail safe cooling system
US6646878B2 · kind B2 · utility
41Cited by
15References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 16, 2001 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Jul 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2019
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for cooling electronic components comprising drawing air into a chassis; causing the air to come in contact with a corrugated deflector; and cooling electronic components with the air before the air exits the chassis. A fail safe system for cooling electronic components comprising a corrugated deflector; a plurality of fans, positioned such that they cause air to come in contact with the corrugated deflector; and an electronic component; wherein the electronic component is cooled by the air.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.