Flip-chip assembly for optically-pumped lasers
US6647050B2 · kind B2 · utility
8Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2001 |
| Grant date | Nov 11, 2003 |
| Priority date | — |
| Expiry date | Sep 18, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/426
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A short-wavelength vertical cavity surface emitting laser (VCSEL) is flip-chip bonded to a long-wavelength VCSEL. The short-wavelength VCSEL is used to optically-pump the long-wavelength VCSEL. Certain embodiments of the invention can serve as optical sources for optical fiber communication systems. Methods also are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.