Process for manufacturing electronic device packages
US6647603B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 5, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Mar 9, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49179
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing electronic device packages includes a step of forming a metal sheet into a runner part and a plurality of spaced apart terminal parts. The runner part extends in a longitudinal direction. The terminal parts are connected to the runner part and are aligned in the longitudinal direction. Each of the terminal parts includes a pair of spaced apart connecting legs that have lower inserting sections connected to the runner part, and upper soldering sections which extend from the lower inserting sections and which are offset from each other in a transverse direction relative to the longitudinal direction so as to define an inserting gap therebetween. The process further includes the steps of positioning an electronic element in the gap in each terminal part, and respectively connecting the upper soldering sections to two opposite side faces of the electronic element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.