Electrical resistance reduction method for thermosetting conductive epoxy contacts in integrated lead suspensions
US6647621B1 · kind B1 · utility
43Cited by
4References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Mar 21, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49211
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for efficiently producing low resistance electrical contacts between stainless steel and conductive layers in integrated lead suspensions and components. The method includes applying an amount of current for a period of time which is effective to reduce the resistance to a desired level. One embodiment of the invention includes applying a 100 mA current for 16 msec to a contact formed by thermosetting conductive epoxy. Resistance levels below 1 ohm can be achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.