Method for fabricating a heat pipe structure in a radiating plate
US6647625B2 · kind B2 · utility
15Cited by
3References
11Claims
0Family size
Inventors
Key dates
| Filing date | Dec 13, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Jan 11, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49353
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A method for fabricating a heat pipe structure in a radiating plate is provided. A tunneling means is used to form a plurality of radiating channels in the radiating plate. Each of the plurality of radiating channels has only one opening. Then, only one of the openings of the radiating channels is left unsealed, while sealing the other openings of the radiating channels. Working fluid is injected into the radiating channels via the unsealed opening. The radiating channels are vacuated and the unsealed opening is sealed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.