Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin
US6648211B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Jul 31, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12882
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A pin standing resin substrate including a resin substrate having a substantially plate-shaped main surface and composed of one of a resin and a composite material containing a resin, and having a pin-pad exposed from the main surface; and a pin soldered to the pin-pad, wherein the pin has been thermally treated by heating so as to soften the pin. The pin has a rod-like portion composed of a copper base metal and an enlarged diameter portion made of the same material as the rod-like portion. The enlarged diameter portion has a larger diameter than the rod-like portion and is formed at one end of the rod-like portion. At least the enlarged diameter portion is soldered to the pin-pad. Also disclosed is a method of making the pin standing resin substrate, a pin for bonding with the resin substrate, and a method of making the pin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.