Adhesion method and electronic component
US6649012B2 · kind B2 · utility
288Cited by
1References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2000 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Jun 12, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/25
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides an adhesion method of improving the heat conduction in a fixed direction by using a heat conductive adhesive made by blending boron nitride powder and adhesive polymer and adhering by orienting boron nitride powder in the heat conductive adhesive to the fixed direction under the magnetic atmosphere and an electronic component for effectively dissipating heat generated from semiconductor device 2, power source 4, light source or other components used for the electric products, and an electronic component excellent in radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.