Method and apparatus for removing coating layers from alignment marks on a wafer
US6649077B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Mar 17, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/975
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and an apparatus for removing coating layers from the top of alignment marks on a wafer situated in a spin processor are described. The method may be carried out by first providing a spin process equipped with a rotatable wafer pedestal, then providing a wafer that has at least one alignment mark covered by a coating layer, mounting an edge ring on an outer periphery of the wafer pedestal, the edge ring has at least one tab section extending outwardly from an inner periphery of the edge ring, then positioning the wafer faced down and supported by an inert gas flow on the edge ring such that a narrow gap is formed between the tab section on the edge ring and the alignment marks and dispensing an etchant onto a backside of the wafer while rotating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.