Patent · US Expired

Thin film capillary process and apparatus

US6649078B2 · kind B2 · utility

39Cited by
55References
18Claims
0Family size

Assignee

Inventor

Key dates

Filing dateDec 6, 2000
Grant dateNov 18, 2003
Priority date—
Expiry dateOct 18, 2021

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB81B2203/0376
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

Method and system of forming microfluidic capillaries in a variety of substrate materials. A first layer of a material such as silicon dioxide is applied to a channel etched in substrate. A second, sacrificial layer of a material such as a polymer is deposited on the first layer. A third layer which may be of the same material as the first layer is placed on the second layer. The sacrificial layer is removed to form a smooth walled capillary in the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.