Patent · US Expired

Method of manufacturing interconnection components with integral conductive elastomeric sheet material

US6649115B2 · kind B2 · utility

2Cited by
12References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 4, 2002
Grant dateNov 18, 2003
Priority date
Expiry dateNov 4, 2022

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01R43/007
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A method of forming an interconnection component with integral conductive elastomeric sheet material, comprising providing a connector frame defining an opening, casting uncured elastomeric conductive polymer interface (ECPI) material onto the connector frame spanning the opening, and curing the ECPI in the presence of a magnetic field, to integrally couple the ECPI to the connector frame, and create a series of spaced conductive columns through the ECPI thickness.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.