Method and apparatus for inductively coupled plasma treatment
US6649223B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2002 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Aug 13, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/321
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The apparatus for plasma treatment of a non-conductive hollow substrate (5), comprises a plasma chamber (12) provided with two oppositely facing field admission windows (8, 9), and first and second opposite coil arrangements (20, 30) located on an outer surface (8a; 9a) of the first and second windows respectively. The first and second coil arrangements being connected to power supply means (4) such that a current (I) of a same direction flows simultaneously in the first and second coil arrangements. The two coil arrangements (20, 30) induce through the substrate a magnetic flux (7) transversal and perpendicular to a substrate depth (L) for generating an electrical field in the substrate plan.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.