Heat conductive silicone composition and semiconductor device
US6649258B2 · kind B2 · utility
15Cited by
9References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2002 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Apr 29, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A heat conductive silicone composition comprising (A) an alkenyl group-bearing organopolysiloxane, (B) an organohydrogenpolysiloxane having Si—H groups on side chains, (C) an organohydrogenpolysiloxane having an Si—H group at either end, (D) a filler consisting of aluminum powder and zinc oxide powder in a weight ratio of from 1/1 to 10/1, (E) a platinum catalyst, and (F) a regulator has a high thermal conductivity and maintains flexibility even when exposed to heat for an extended period of time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.