Precision micromirror positioning
US6649435B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Dec 31, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/054
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A system and method of aligning a micromirror array to the micromirror package and the micromirror package to a display system. The system and method improve the alignment of the micromirror array to the display system by using a consistent set of precision reference regions. The micromirror package substrate 700 engages an alignment fixture portion of a die mounter 702 during the die mount operation, and a similar fixture when installed in a display system. The package substrate 700 is held by the predefined regions on two edges and the three predefined regions on the top surface. When mounting the device in the package optical techniques may be used for x-y plane alignment. Spring plunger 710 biases the substrate against the contact points 708 on the top surface. In the display system or other end equipment, a socket contacts the same six points to align the device. The preceding abstract is submitted with the understanding that it only will be used to assist in determining, from a cursory inspection, the nature and gist of the technical disclosure as described in 37 C.F.R. §1.72(b). In no case should this abstract be used for interpreting the scope of any patent claims.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.