Method for manufacturing a composite member from a porous substrate by selectively infiltrating conductive material into the substrate to form via and wiring regions
US6649516B2 · kind B2 · utility
11Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2002 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Jun 5, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49215
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method for manufacturing a composite member comprising a porous substrate, a via, and a wiring. The method comprises exposing a first region and a second region in the porous substrate to a exposure beam through a mask, the second region exposed by the exposure beam not more than 50% of the exposure of the first region, the exposure beam having the wavelength that an average size of voids of the porous substrate is, as expressed by a radius of gyration, {fraction (1/20)} to 10 times, and forming the via and the wiring by infiltrating a conductive material into the first region and the second region respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.