Adhesive composition primarily intended for use in medical applications
US6649681B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Apr 14, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2423/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention provides an adhesive composition for use in bonding a polymeric fitting to an olefin-containing component of an article used in medical applications. The adhesive composition according to the invention includes an adhesive polymer system dissolved in a solvent system. The solvent system includes an organic solvent having a solubility parameter within the range of from about 7.5 to about 10 (cal/cm3)1/2. Subsequent to forming a bond between the polymeric fitting and the olefin-containing component, the adhesive composition can meet the requirements for USP Class VI materials. In a preferred embodiment of the invention, the adhesive composition includes a low shear mixture of an adhesive polymer system including an atactic polypropylene and a low density polyethylene that is dissolved in a solvent system including a blend of d-limonene and a ketone selected from the group consisting of 4-heptanone and cyclohexanone. The adhesive composition can be used, for example, to bond polymeric fittings made of materials such as, but not limited to, acrylic, polycarbonate, polyvinyl chloride, polyolefin, acrylonitrile butadiene-styrene, and polyester, to olefin-containing …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.