Apparatus and method for coupling with components in a surface mount package
US6649832B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Aug 31, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment of the present invention provides a method and apparatus that effectuates a direct functional interface directly with individual constituent subcomponents of the internal die component, or with particular circuit nodes or conductive trace locales of the surface mount package, without high frequency signal degradation or other electrical problems. An embodiment of the present invention also provides a method and apparatus that effectuates testing access, directly to the internal die component of the surface mount package or to a particular circuit node or conductive trace locale of the surface mount package, enabling performance evaluation and system debugging. Further, an embodiment of the present invention provides a method and apparatus that effectuates integration of surface mount package with an opto-electronic package. Further still, an embodiment of the present invention provides a method and apparatus that achieves these advantages with minimal cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.