Patent · US Expired

Method of laser drilling

US6649864B2 · kind B2 · utility

11Cited by

8References

19Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Hubert De Steur · Drongen, BE
Hans Juergen Mayer · Viernheim, DE
Otto Märten · Dreieich, DE
Christian Overmann · Karlsruhe, DE
Wei Pan · Evergem, BE
Eddy Roelants · Brugge, BE
Martin Wehner · Herzogenrath, DE

Key dates

Filing date	Feb 19, 2002
Grant date	Nov 18, 2003
Priority date	—
Expiry date	Feb 19, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/0554
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

In a method for the laser drilling of holes in a circuit substrate with the aid of a perforated mask, a laser beam is moved in the region of the perforated mask on a circular path. The center point of the region lies concentrically with respect to the set position of the respective hole in the mask. Further, the diameter of the region is smaller than the diameter of the hole. At the same time, the diameter of the laser beam spot is chosen to be large enough that it always covers the center point of the perforated mask during the circular motion. As a result, an energy distribution of the laser energy, which is as uniform as possible, is achieved in the region of the perforated mask.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.