Tool head for laser machining of materials
US6649866B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2002 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | May 6, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/1476
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention is directed to a tool head for machining of materials by laser, substantially comprising focusing optics which are arranged in a housing and through which a laser beam bundle is directed to the workpiece surface to be machined, a nozzle which coaxially surrounds the optical axis of the laser beam bundle and conducts gas in the beam direction in order to prevent contamination of the focusing optics by particles released on the workpiece surface to be machined, a pipe which coaxially surrounds the nozzle and which likewise conducts gas for preventing contamination of the nozzle, and a suction device with suction nozzles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.