Workpiece enclosure system and robotic laser processing system including pass through partitions
US6649868B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Jul 31, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/127
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A light-tight laser enclosure system including an enclosure, a robotic laser, first and second pass through partitions, and first and second rotary positioners. The robotic laser is positioned within an interior volume of the enclosure and defines a processing envelope. The first pass through partition defines a first passage in selective communication with interior and exterior volumes of the enclosure, and is configured to maintain a light-tight configuration as the first passage is placed in selective communication with the interior and exterior volumes. The second pass through partition defines a second passage in selective communication with interior and exterior volumes of the enclosure, and is configured to maintain a light-tight configuration as the second passage is placed in selective communication with the interior and exterior volumes. The first and second rotary positioners are configured to secure a workpiece within the first and the second passages, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.