Thin film composite containing a nickel-coated copper substrate and energy storage device containing the same
US6649930B2 · kind B2 · utility
7Cited by
10References
28Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 25, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Jun 25, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/388
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a process of preparing a copper/nickel substrate by annealing nickel-coated copper. After the nickel deposition step, a dielectric, such as lead zirconate titanate (PZT), may be deposited onto the substrate by methods known in the art such as sol-gel or vacuum deposition. This invention further relates to thin film composites. These composites include a pre-annealed nickel-coated copper substrate and a dielectric such as PZT.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.