Magnetic head assembly with electrostatic discharge (ESD) shunt/pads seed layer
US6650511B2 · kind B2 · utility
13Cited by
20References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2002 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Apr 18, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B2005/3996
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer electrically conductive shunt is located on the exterior surface of a slider in electrical contact and extending between first and second lead ends of leads that are connected to a sensor of a read head. Electrically conductive spaced apart first and second read pads are located on the conductive shunt in electrical contact with the first and second lead ends via the conductive shunt. The conductive shunt includes a thick gold layer which is located between and interfaces an adhesion layer and a cap layer wherein the adhesion layer makes direct electrical contact with the aforementioned first and second lead ends.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.