Low profile DC distribution module for a power supply unit
US6650537B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Dec 30, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/26
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A DC distribution module for a power supply unit is modular and facilitates thermal cooling of the unit. The power supply unit preferably includes a housing in which one or more power supply modules and the DC distribution module can be inserted. The DC distribution module preferably comprises two power conductors laminated and bonded to a ground conductor. The DC distribution module is relatively thin compared to the power supplies inserted into the power supply unit. By being relatively thin, the DC distribution module, which may carry substantial amounts of current, does not substantially interfere with air movement through the power supply unit for thermal cooling purposes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.