Chip component assembly
US6650546B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2001 |
| Grant date | Nov 18, 2003 |
| Priority date | — |
| Expiry date | Feb 27, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A chip component assembly is provided that includes a plurality of chip components each having respective first and second terminal elements, the first terminal elements being joined to corresponding solder pads on a printed circuit board, the solder pads being in communication with electronic circuitry of the printed circuit board, and the second terminal elements being joined together by an array ground plane of a grounding device. The grounding device additionally includes a ground path structure which physically and electrically connects the array ground plane, and thus the chip components, to a ground pad located on the printed circuit board so as to provide a ground path from the chip components. Preferably, the array ground plane additionally includes a plurality of resilient contact elements which provide for substantial and continuous contact between the array ground plane and an ancillary ground plane, such as the top cover of a PC card. The grounding device serves to foreclose electrostatic discharge or EMI by the chip components and in some applications further serves to direct undesirable noise to ground. The relatively small size of the grounding device permits the us…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.