Method for making a printed wire board having a heat-sinking solder pad
US6651323B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 7, 2001 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Nov 19, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a surface mount solder pad that is adapted to function as a heat sink for an electronic component soldered to the pad. The method comprises a step of providing a printed wiring board having a conductive layer disposed thereon. The method further comprises a step of selecting a size and arrangement of regions of a solder pad so as to sink sufficient heat. The method also comprises removing non-selected regions of the conductive layer to produce solder pads on the surface of the printed wiring board enhanced with features that promote heat transfer to sink enough heat generated by one of the surface mount components to provide for its proper operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.