Evaporator of CPL cooling apparatus having fine wick structure
US6651735B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2002 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | May 15, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An evaporator of a capillary pumped loop (CPL) cooling apparatus having a fine wick structure is provided. The evaporator having a flat board shape, of a capillary pumped loop (CPL) cooling apparatus includes a coolant storing part for storing in-flowing coolant from the condenser and collecting a uncondensed gas contained in the in-flowing coolant in an upper space, a cooling part for cooling the heating body through vaporization of the coolant, and superstructure and substructure combined with each other, for defining a channel region in which the coolant flows from the coolant storing part to the cooling part by a capillary action. In this case, the substructure includes a first substructure used as a substrate and a second substructure formed along a border of the substrate, or includes first through third segments equal to the first and second substructures. The channel region is formed between the second segment and the superstructure, and a pumping means formed of patterns that are formed so that the capillary action is generated in the coolant, or a porous material is included in the channel region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.