Method and apparatus for disassembling joined layers
US6651872B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2001 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Oct 10, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K20/106
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention is a disassembly apparatus and method for disassembling a workpiece having at least two layers joined together by welding or other bonding processes at bonding points. The method includes the steps of securing the workpiece into a fixture to prevent movement of one of the layers. The apparatus includes a sonotrode and a holding device. The method further includes moving the sonotrode to contact the workpiece to apply a predetermined amount of contact pressure to the workpiece. The sonotrode in contact with the layer on a side opposite the anvil is then vibrated at a predetermined frequency until the layers become disassembled. An apparatus for performing the method is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.