Method and device for changing a semiconductor wafer position
US6652216B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2000 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Nov 3, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mechanical apparatus and method are disclosed for orienting and positioning semiconductor wafers while avoiding contamination of elements on the faces thereof, by only contacting the peripheries thereof. The apparatus may include a frame for wafer supports and a semiconductor wafer gripping arm. The gripping arm is mounted on a translator for movement in X, Y, and Z directions to engage and move wafers in, from, and between supports. The gripping arm comprises a, rigid structure with a plurality of semiconductor support wheels mounted thereon to support a wafer only around its periphery. A drive wheel is provided to orient a supported wafer rotationally while it is being supported around its periphery. A detector is provided to detect orientation of the wafer relative to a notch or other position mark on its periphery.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.